Board-to-Board Header for Low-Count Signal Interconnects
Its 0.100" (2.54 mm) pitch and row spacing match standard perf-board and legacy PCB layouts, making it a direct fit for 2-circuit BOM lines where a right-angle, through-hole solder termination is needed. The header carries gold or GXT™ plating on the mating surface at 30.0 µin (0.76 µm) thickness, rated for repeated mating cycles without contact fretting, with tin-plated solder tails for reliable wave-solder joints.
The 5 A per-circuit rating is typical for signal-level board-to-board interconnects at this pitch — the limiting factor is the narrow pin cross-section and the UL94 V-0 housing's temperature rise ceiling, not the phosphor bronze contact itself. Derate above 25°C ambient per the standard derating curve. The 0.160" (4.06 mm) mating pin length gives enough wipe for a reliable first mate with the matching receptacle.
Right-Angle Footprint and Board Layout
The 0.120" (3.05 mm) post length is sized for standard 1.6 mm PCBs with a through-hole solder joint; the 0.190" (4.83 mm) insulation height gives clearance for routing traces under the body.