Board-to-Board Header for Dense Pin Arrays
The Amphenol 93939-142HLF is a 42-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board interconnect applications. It uses the standard 0.100" (2.54mm) pitch, which keeps the PCB footprint compatible with a wide range of prototyping grids and production layouts. The right-angle orientation places the pin rows parallel to the board surface, useful for mezzanine stacking or edge-to-edge connections where the mated board sits at 90 degrees.
Contact Plating and Current Handling
The mating contacts carry a gold or GXT™ finish at 30.0 µ" (0.76 µm) thickness, while the solder tails are tin-plated. The gold on the mating interface supports repeated mating cycles without oxidation buildup, making it a fit for assemblies that see field service or multiple board insertions. Rated at 5 A per contact, the current limit is typical for this pin density and pitch — the limiting factor in practice is the temperature rise in the mated stack, not the contact itself.
Mechanical and Environmental Fit
The through-hole right-angle mounting requires a drilled PCB with plated holes; the 0.120" (3.05 mm) post length gives enough stand-off for solder fillets on the secondary side. The unshrouded design means there is no plastic wall around the pins, so the mating receptacle must provide its own alignment — this keeps the header footprint compact but demands care during blind mating. The UL94 V-0 rated black housing suits equipment requiring a flammability rating inside an enclosure.