Product Overview
It uses a 0.100" (2.54 mm) square-pin grid on both the row-to-row and pin-to-pin spacing, giving you a dense but standard-pitch footprint for board-to-board stacking or wire-to-board through a mating receptacle. The mating contacts carry 30.0 µ" (0.76 µm) gold plating over the phosphor bronze base, a thickness that supports repeated mating cycles without exposing the base metal to oxidation. The post (solder tail) side is tin-plated for a reliable solder joint into the plated through-hole.
Mating and Fit
The push-pull retention relies on contact interference fit rather than a latch.