Board-to-Board Header, 62 Positions, 0.100" Pitch
The FCI 93939-162HLF is a 62-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board interconnect applications. It uses a standard 0.100" (2.54mm) pitch on both rows and contacts, matching the legacy DIP footprint for straightforward PCB layout. The right-angle through-hole termination places the mated board parallel to the main PCB, useful for mezzanine or perpendicular stacking where height is constrained. Rated 5A per contact with a 110V voltage rating, it handles moderate signal and power duty in a single connector.
Contact Plating and Mating Interface
The mating interface carries 30.0 µ" (0.76 µm) of gold or GXT™ plating over phosphor bronze contacts, while the solder tails are tin-plated. The 30 µ" gold layer is thick enough for repeated mating cycles in corrosive or field-service environments — the tin tails handle the solder joint without requiring gold on the board side. The unshrouded design means the pins are exposed; board layout should keep adjacent components clear of the pin field.
Mounting and Mechanical Details
Through-hole right-angle mounting with a 0.120" (3.05mm) post length and 0.160" (4.06mm) mating pin length. The insulation height of 0.190" (4.83mm) sets the standoff from the board. The push-pull fastening type means no locking latch — the retention comes from the friction of the pin-to-receptacle interface and the solder joints. The housing is rated UL94 V-0 for flame resistance, required for equipment inside an enclosure.