Board-to-Board Header for Standard Grid Layouts
The Amphenol BERGSTIK® II 93939-410HLF is a 10-position, dual-row unshrouded header on the industry-standard 0.100" (2.54 mm) pitch. It is a through-hole, right-angle male pin header designed for board-to-board interconnect applications where a low-profile, unshrouded interface is acceptable. The 0.100" row spacing mirrors the pitch, so the footprint matches a standard 0.100" grid — no custom pad layout needed for prototyping or production boards. The 0.160" (4.06 mm) mating pin length provides enough engagement depth for standard BERGSTIK receptacles without bottoming out in the mating housing.
The 5 A rating is typical for a 0.100" pitch tin-plated contact; derate above 25 °C ambient per the manufacturer's curve. The tin-on-tin mating interface with 100 µ" (2.54 µm) of tin on the mating side is a heavy-duty plating for moderate mating cycles — expect several hundred mates before wear-through, but not the thousands a gold-plated contact would deliver. Tin is cost-effective for internal connections that stay mated for the life of the assembly.
The 0.120" (3.05 mm) solder tail length is standard for a 0.062" board thickness; for thicker boards, confirm the tail protrudes enough for a reliable solder fillet. The 0.190" (4.83 mm) insulation height keeps the pin base above the board, allowing clearance for traces or components under the header body.