The Amphenol 93939-450HLF is a 50-position, dual-row unshrouded header from the BERGSTIK® II series, built on the standard 0.100" (2.54 mm) pitch grid. It is a board-to-board interconnect — male square pins, right-angle through-hole termination, push-pull fastening. The 50 positions are fully loaded across two rows, giving 25 pins per row at a row spacing of 0.100" (2.54 mm). This is the high-density end of the BERGSTIK II line for a dual-row, unshrouded format.
The 0.100" pitch and row spacing match the legacy DIP footprint grid — the board layout is a standard 0.100" x 0.100" hole pattern. The insulation height of 0.190" (4.83 mm) and mating pin length of 0.160" (4.06 mm) define the stack-height envelope when mated with a standard receptacle.
Termination is through-hole solder, with a post length of 0.120" (3.05 mm) for the solder tail — suitable for standard PCB thicknesses in the 0.062" to 0.093" range.