The Amphenol 93939-470HLF is a 70-position, dual-row unshrouded header from the BERGSTIK® II series, on a 0.100" (2.54mm) pitch with matching 0.100" row spacing. It is a board-to-board interconnect — male pin, square contact shape, through-hole right-angle mounting. This is a high-density, low-cost header for parallel or perpendicular board stacking where the unshrouded pins allow direct mating with a receptacle or another header.
With 70 positions loaded across two rows, the header spans 35 positions per row — the board footprint must accommodate 70 through-hole solder tails on 0.100" centers, with a row-to-row spacing of 0.100".
The operating temperature range is not explicitly listed but is typical for the BERGSTIK II series; derate current above 25 °C per the manufacturer's derating curve.