Board-to-board unshrouded header
The 93944-411HLF is the 11-position member of Amphenol's BERGSTIK II unshrouded header line, a single-row through-hole part for board-to-board stacking. Rated 3 A per contact with tin-on-tin mating finish, 100.0 µin (2.54 µm) thick on the mating side, and a UL94 V-0 black insulation body rated -65°C to 130°C.
Pitch and footprint fit
The 0.100" (2.54 mm) pitch and single-row layout keep the board footprint compact — the 11 positions fit a 1.000" row of plated through holes. The unshrouded design leaves the mating interface open for visual inspection on the line.