Board-to-board unshrouded header, 30 positions
The 93992-430HLF: Tin-plated mating contacts carry 3 A per circuit; the through-hole solder termination suits board-level assembly where the header is soldered into plated through-holes.

Amphenol BERGSTIK II header, order code 93992-430HLF, 30 positions, single row, 0.100" (2.54 mm) pitch, 3 A, tin-plated mating contacts, through-hole, solder termination.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 30 |
| Contact finish - post | Tin |
| Contact length - post | 0.085\" (2.16mm) |
| Overall contact length | 0.415\" (10.54mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
The 93992-430HLF: Tin-plated mating contacts carry 3 A per circuit; the through-hole solder termination suits board-level assembly where the header is soldered into plated through-holes.
Amphenol supplies the 93992-430HLF under the BERGSTIK II series.
The listed style is Board to Board, meaning the header is designed to mate with a receptacle on another PCB in a board-to-board stack-up.
The housing carries UL94 V-0 flammability rating. RoHS and REACH compliance documentation is available from Amphenol per the standard product documentation package.