28-position unshrouded header in BERGSTIK II
The 94063-128HLF is the 28-position member of Amphenol's BERGSTIK® II header line, a single-row unshrouded board-to-board interconnect. Rated 3 A per contact with a 0.100" (2.54 mm) pitch, it uses gold or GXT™ mating contacts at 30.0 µin (0.76 µm) thickness and a through-hole solder termination.
Pitch, plating, and temperature range
The 0.100" (2.54 mm) pitch and single-row layout set the board footprint for routing density; the gold or GXT™ contact finish supports repeated mating cycles in corrosive or field-service environments. Operating temperature spans -65°C to 130°C, and the housing carries a UL94 V-0 flammability rating.