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Amphenol 94611-429HLF — Pin Headers, Sockets & Housings

Amphenol ICC (FCI) 94611-429HLF Header, 29-Pos 0.100" Pitch

MPN94611-429HLF
Active

Amphenol ICC (FCI) BERGSTIK® II header, order code 94611-429HLF, 29 positions, single row, 0.100" (2.54mm) pitch, 3 A, tin-plated mating contacts, through-hole, solder termination.

$3.4774Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

94611-429HLF key specifications
ParameterValue
SeriesBERGSTIK® II
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board

All specifications

94611-429HLF additional specifications
ParameterValue
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions29
Contact finish - postTin
Contact length - post0.095\" (2.41mm)
Overall contact length0.320\" (8.13mm)
Contact finish - matingTin
Contact length - mating0.125\" (3.18mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

Amphenol ICC (FCI) BERGSTIK® II header, order code 94611-429HLF, 29 positions, single row, 0.100" (2.54mm) pitch, 3 A, tin-plated mating contacts, through-hole, solder termination.

Frequently asked questions

What is the closest pin-compatible alternative to 94611-429HLF in this Pin Headers, Sockets & Housings family?

No same-series sibling with a different position count or plating is listed as a direct cross. The 94611-429HLF is the 29-position, single-row, tin-mating member of the BERGSTIK® II series — any alternative would need to match the 0.100" pitch, single row, and through-hole footprint.