Amphenol ICC (FCI) BERGSTIK® II, 94674-108LF, Board to Board, Header, Male Pin, 8 Positions, 2 Rows, 0.100" (2.54mm) Pitch, Through Hole, Press-Fit/Solder, 30.0µin Gold Mating, Tin Post, 3A, UL94 V-0
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Press-Fit, Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 8 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.185\" (4.70mm) |
| Overall contact length | 0.505\" (12.83mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The tin tail is standard for through-hole soldering.
Press-fit allows solderless assembly into plated through-holes — useful for backplane applications where rework or high-reliability solder joints are a concern. The solder option is the conventional through-hole method for standard wave or hand-soldering processes.
Sourced through independent distribution channels.
The pitch is 0.100" (2.54 mm) on both the mating interface and the row spacing.