20-position unshrouded header at 2.54 mm pitch
The 94674-120LF is the 20-circuit member of Amphenol's BERGSTIK® II unshrouded header line, a dual-row board-to-board interconnect on 0.100" (2.54 mm) pitch. Gold mating contacts rated 3 A per circuit, with 30.0 µin (0.76 µm) gold thickness on the mating surface and tin on the solder posts, terminated through-hole via press-fit or solder.
Position count within the BERGSTIK II series
The 20-position 94674-120LF sits at the middle of the BERGSTIK II dual-row range — the 0.100" (2.54 mm) pitch and 0.100" (2.54 mm) row spacing are shared across the series, so the board footprint is identical; only the position count changes to match the circuit count.