XCede® Backplane Header for Dense Routing
Its 0.073" (1.85mm) pitch packs signal density into a compact footprint, while the press-fit termination eliminates solder joints for a more reliable assembly in high-vibration environments. Rated 6 A per contact with gold-plated mating surfaces, it handles moderate signal and low-power distribution within a backplane chassis.
Press-Fit Termination and Board Layout Fit
Press-fit termination means this header is through-hole mounted but requires no wave or reflow solder — the compliant pin compresses into the plated through-hole, creating a gas-tight joint. For the board layout engineer, the 0.073" (1.85mm) pitch sets the routing channel width between pads; at this density, a 6-position header occupies roughly 0.44" of board edge.