The 95278-101-36: The housing is UL94 V-0 rated black thermoplastic.
Obsolete — sourcing options
Available through independent surplus channels. No stock-holding claim; sourced per RFQ against the BOM quantity.
Amphenol ICC (FCI) 95278-101-36 BERGSTIK Header, 36-Pos
MPN95278-101-36
Obsolete
Amphenol ICC (FCI) BERGSTIK header, order code 95278-101-36, 36 positions, dual row, 0.100" (2.54mm) pitch, unshrouded, male pin, gold GXT mating contacts 30.0µin (0.76µm), surface-mount, solder termination.
$3.5006Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
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Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
All specifications
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 36 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.232\" (5.90mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Product details
Frequently asked questions
What connector series does the 95278-101-36 belong to, and what is its pitch?
The 95278-101-36 is a member of Molex's BERGSTIK® series, operating at a 0.100-inch (2.54mm) pitch with a dual-row layout and 36 positions — all positions loaded.
What termination style does the 95278-101-36 use, and what is the mounting type?
It uses surface-mount termination with tin-lead post plating at 150.0µin (3.81µm) for reliable solder joint formation. The mounting type is surface mount, and the connector style is listed as Board to Board — a breakaway header intended for board-stacking applications.