14-Pin Unshrouded Header — Board-to-Board Footprint
The tin-lead post finish (150.0µin) is compatible with standard solder reflow profiles.
Surface-Mount Termination — Reflow Assembly
Termination is solder-only, surface-mount (SMT). The 0.100" insulation height matches the standoff for many mezzanine stacking applications.
Obsolete — Sourced Against RFQ
The base product number 95278 covers the series; any active variant would carry a different suffix. Available through independent distribution channels.
