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95278-401-06LF — Amphenol product photo

95278-401-06LF BERGSTIK® 6-Pin SMD Header, 2.54mm Pitch

MPN95278-401-06LF
Active

Amphenol ICC (FCI) BERGSTIK® 95278-401-06LF, 6-position dual-row unshrouded header, 0.100" (2.54mm) pitch, surface-mount solder termination, tin-plated contacts rated 3 A per contact, UL94 V-0 thermoplastic housing.

$0.7600Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

95278-401-06LF Technical Specifications
ParameterValue
SeriesBERGSTIK®
GenderMale Pin
Mounting typeSurface Mount
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions6
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact finish - matingTin
Contact length - mating0.232\" (5.90mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating78.7µin (2.00µm)

Product details

6-Pin Dual-Row SMD Header — What the 2.54mm Pitch Means for Your Board

The 95278-401-06LF: The surface-mount termination means the SMD pads must align exactly to the 2.54mm grid; no through-hole staking, so the reflow profile and pad geometry are the only mechanical hold.

Active Production — Sourcing Against the BOM Line

The base product number is 95278; the full order code is 95278-401-06LF.

The gold version carries the same 3 A rating and UL94 V-0 housing, but the 30.0µin gold finish supports more mating cycles without contact degradation. If your board-to-board interconnect sees frequent reconnects during test or field service, the gold sibling is the better fit; for a one-time assembly, the tin version saves cost.

Frequently asked questions

What is the pinout and row configuration of 95278-401-06LF?

It is a 6-position, dual-row header with all positions loaded. The pitch is 0.100" (2.54mm) both between pins in a row and between rows.

Is 95278-401-06LF a direct replacement for 95278-101-06LF?

No — the two parts share the same 6-position, dual-row, SMD, 2.54mm pitch form factor, but 95278-101-06LF uses gold/GXT™ on the mating surface instead of tin. They are functionally interchangeable in the same footprint, but the gold version supports more mating cycles. Confirm your application's reconnect duty before substituting.

What is the mounting height of this header?

The insulation height above the board is 0.100" (2.54mm).