Board-to-Board Interconnect with Breakaway Flexibility
Tin Plating and Current Rating for Signal-Duty Interconnects
Tin plating is cost-effective for low-cycle applications — expect fewer than 50 mating cycles before the tin oxide layer increases contact resistance. For designs that require repeated field service or frequent reconnection, a gold-plated BergStik variant is the better choice. Derate current above 25°C ambient per the product drawing; the wide temperature range means the connector can operate at 125°C, but the current must be reduced accordingly.
Mating, Mounting, and Orientation
The header is loaded in all 18 positions, so the full complement of pins is present. The square male pin contact shape provides a reliable gas-tight interface with the receptacle's female contact. For board-to-board stacking, the mated stack height depends on the receptacle chosen — typical BergStik receptacles add 0.100" to 0.200" to the overall height.
The base product number is 95278, which covers the BergStik SMT header family. The -401-18LF suffix specifies the 18-position, tin-plated, SMT variant.