Board Fit and Layout Essentials
Surface-mount termination suits reflow assembly, with the 0.100" insulation height setting the standoff above the PCB. The tin-lead post finish (150.0 µinch) is a legacy solderability layer; verify compatibility with RoHS reflow profiles if the board assembly requires lead-free solder.
Amphenol ICC (FCI) has marked this part obsolete. No direct replacement is listed on the official record. The BERGSTIK series includes many active breakaway headers, but pin-compatibility — same pitch, position count, SMT footprint, and mating length — must be verified against the original board layout. Available through independent distribution channels. No stock-holding claim; sourced per request against the BOM quantity.
Push-pull retention means no locking latch; in vibration-prone environments, consider a receptacle with a friction lock or a secondary retention method. Termination is solder-only — no press-fit or compliant-pin option. The phosphor bronze contact material offers good spring properties for repeated insertion.