Amphenol ICC (FCI) BERGSTIK® series, 40-position dual-row unshrouded header, 0.100" (2.54mm) pitch, surface mount, Gold GXT™ mating finish, UL94 V-0 thermoplastic, bulk packaging.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Gender | Male Pin |
| Mounting type | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 40 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.232\" (5.90mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 95278-801-40: The post finish is tin-lead at 150.0µin (3.81µm), a legacy solder alloy that requires a lead-compatible reflow profile.
The 40-position dual-row unshrouded header format is common across the BERGSTIK family, but a direct drop-in substitute from the same manufacturer cannot be confirmed without a board spin or a careful footprint comparison.
Surface mount termination — the SMT tails reflow onto the PCB pads.
We can source this obsolete part to order against your BOM. No stock-holding or immediate-shipment claim is made.