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Amphenol 95278-801B34LF — Pin Headers, Sockets & Housings

95278-801B34LF Amphenol ICC (FCI) BERGSTIK® Header, 34 Pos

MPN95278-801B34LF
Active

Amphenol ICC (FCI) BERGSTIK®, 95278-801B34LF, unshrouded male pin header, 34 circuits, 2 rows, 0.100" (2.54 mm) pitch, surface-mount solder termination, Gold GXT™ mating finish, 3 A per contact, UL94 V-0.

$2.4360Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

95278-801B34LF key specifications
ParameterValue
SeriesBERGSTIK®
TypeMale Pin
MountingSurface Mount
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

95278-801B34LF additional specifications
ParameterValue
StyleBoard to Board
PackageTube
FeaturesPick and Place
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions34
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact finish - matingGold, GXT™
Contact length - mating0.232\" (5.90mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating15.0µin (0.38µm)

Product details

Surface-Mount Breakaway — Board Assembly Fit

The 95278-801B34LF: This is a surface-mount (SMT) version of the BERGSTIK® header, supplied in tube packaging. The Pick and Place feature means the header is compatible with automated assembly — the flat top surface and balanced geometry allow vacuum pickup without tilt. Unshrouded and push-pull fastening — there is no latch or locking ramp.

Active Production — Sourcing Reality

The base product number is 95278; variations in plating, packaging, or circuit count share the same footprint and pin layout.