Amphenol ICC (FCI) BERGSTIK® unshrouded header, 16 positions, 2 rows, 0.100" (2.54mm) pitch, surface-mount solder termination, gold GXT™ mating finish, UL94 V-0, black thermoplastic, bulk pack.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 16 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.315\" (8.00mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 95278-802T16: The surface-mount solder tails reflow directly onto the PCB pads; the 0.100" row spacing matches the mating receptacle's contact pattern. The insulation height of 0.100" (2.54mm) keeps the component profile low on the board.
The solder tails are tin-lead (150.0µin), compatible with standard reflow profiles.
Yes, the manufacturer lists this part as Obsolete. No official successor is documented. Availability is limited to independent surplus channels; confirm stock and lead time at quote.
All positions are loaded.
The solder tails are tin-lead at 150.0µin.