
Amphenol ICC 95278-802T40LF Header 40-Pos 2-Row 3A
Amphenol ICC BERGSTIK 95278-802T40LF, 40-position 2-row unshrouded board-to-board header, 0.100" (2.54mm) pitch, surface-mount solder termination, male square pins, push-pull fastening, 3A per contact, gold GXT plating on mating side (15.0 µin), tin on solder tail (78.7 µin), UL94 V-0 black thermoplastic, insulation height 0.100".
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 40 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.315\" (8.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Frequently asked questions
What is the 95278-802T40LF's connector style on this product line?
The listed style is Board to Board — this is a vertical-stacking header intended for board-to-board or board-to-mezzanine interconnect within a system assembly.
What is the 95278-802T40LF's series designation?
It is listed in the BERGSTIK series — Amphenol ICC's (formerly FCI) family of 0.100" pitch unshrouded breakaway headers used across industrial, instrumentation, and consumer electronics applications.