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95278-809-12LF — Amphenol product photo

95278-809-12LF BERGSTIK® Header SMD 12 Pos 2.54mm Pitch

MPN95278-809-12LF
Active

Amphenol ICC (FCI) BERGSTIK® header, 12 positions, 2 rows, 0.100" (2.54mm) pitch, unshrouded, surface-mount solder termination, male pin square contacts, gold GXT™ mating finish, 3 A per contact, UL94 V-0 thermoplastic, black insulation.

$1.8500Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

95278-809-12LF Technical Specifications
ParameterValue
SeriesBERGSTIK®
GenderMale Pin
Mounting typeSurface Mount
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions12
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact finish - matingGold, GXT™
Contact length - mating0.669\" (17.00mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating15.0µin (0.38µm)

Product details

The 95278-809-12LF: The surface-mount solder termination suits reflow assembly, eliminating the wave-solder step needed for through-hole headers. The 0.669" (17.00mm) mating pin length provides clearance for stacking with standard receptacles. Gold GXT™ plating at 15.0 µinch (0.38µm) on the mating face, with a tin post finish at 78.7 µinch (2.00µm).

RoHS compliant per. The part ships in bag packaging.

Comparing Contact Plating Across Siblings

The 46-position sibling (95278-101-46LF) uses 30.0 µinch gold — double the thickness, which buys roughly double the mating cycle life in a high-reconnect application. For a fixed board-stack design that mates once and stays, the 15.0 µinch is sufficient; for a modular system that sees repeated disconnects, the thicker plating is the better call. The 8-position variant (95278-801A08LF) shares identical plating, pitch, and material spec — only the circuit count and packaging differ (Tape & Reel vs Bag). If your BOM calls for 8 positions and you need pick-and-place ready reels, that sibling is the direct swap.

Board Fit and Termination Checklist

No keying or polarization; orientation is set by the PCB layout. Surface-mount pads require a solder-paste stencil aperture sized to the 0.025" square pin footprint.

Frequently asked questions

What is the pitch and circuit count of 95278-809-12LF?

Row spacing is also 0.100" — a standard grid for board-to-board and wire-to-board interconnects.