Amphenol ICC (FCI) BERGSTIK® series, Board to Board, Header, Breakaway, 14 positions, 1 row, 0.100" (2.54mm) pitch, Surface Mount, Solder, Tin contact finish, 3A, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 14 |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Contact length - mating | 0.318\" (8.08mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 78.7µin (2.00µm) |
Tin at this thickness is a cost-effective choice for applications with fewer than 50 mating cycles; the contact resistance remains stable within the mating cycle life, and the solder tail wets reliably during reflow. Surface-mount termination (SMT) places the solder joints on the bottom of the board, saving z-height compared to through-hole.
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