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95293-801B03LF — Amphenol product photo
Amphenol

95293-801B03LF BERGSTIK® Header, 3-Pos 2.54mm

MPN95293-801B03LF
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Amphenol ICC (FCI) BERGSTIK® header, breakaway, order code 95293-801B03LF, 3 positions, single row, 0.100" (2.54 mm) pitch, 3 A, gold GXT™ mating contacts, surface-mount, solder termination.

$1.4482Ref. price · indicative, final on quote
95293-801B03LF datasheet
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
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Specifications

95293-801B03LF Technical Specifications
ParameterValue
SeriesBERGSTIK®
GenderMale Pin
Mounting typeSurface Mount
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesPick and Place
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions3
Contact finish - postTin
Contact finish - matingGold, GXT™
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating15.0µin (0.38µm)

Product details

3-position BERGSTIK® breakaway header

The 95293-801B03LF is the 3-position member of Amphenol ICC (FCI)'s BERGSTIK® unshrouded breakaway header line, configured as a board-to-board interconnect. Rated 3 A per contact with gold GXT™ plating on the mating surface and tin on the solder tail, it mounts surface-mount with solder termination on a 0.100" (2.54 mm) pitch.

Single-row footprint and plating selection

The single-row layout at 0.100" (2.54 mm) pitch keeps the board footprint narrow — the 3 positions occupy just 0.200" (5.08 mm) of board edge. Gold GXT™ mating contacts (15.0 µin / 0.38 µm) suit repeated mating cycles; the tin-plated posts (78.7 µin / 2.00 µm) match standard solder processes.