3-position BERGSTIK® breakaway header
The 95293-801B03LF is the 3-position member of Amphenol ICC (FCI)'s BERGSTIK® unshrouded breakaway header line, configured as a board-to-board interconnect. Rated 3 A per contact with gold GXT™ plating on the mating surface and tin on the solder tail, it mounts surface-mount with solder termination on a 0.100" (2.54 mm) pitch.
Single-row footprint and plating selection
The single-row layout at 0.100" (2.54 mm) pitch keeps the board footprint narrow — the 3 positions occupy just 0.200" (5.08 mm) of board edge. Gold GXT™ mating contacts (15.0 µin / 0.38 µm) suit repeated mating cycles; the tin-plated posts (78.7 µin / 2.00 µm) match standard solder processes.