4-Pin BERGSTIK® Header for Board-to-Board Interconnects
The 95293-801B04LF: It is designed for board-to-board applications where a compact, low-profile interconnect is needed. The tin-plated solder tails (78.7 µinch) ensure good solderability during reflow.
Surface Mount Termination and Pick-and-Place Ready
This header uses surface mount termination, making it suitable for automated assembly. The pick-and-place feature and tube packaging support high-volume manufacturing without extra handling steps.
Mating and Board Layout Considerations
The 4 positions are all loaded, so no optional pin removal is needed. For a board-to-board connection, the mating half is a BERGSTIK® socket or a compatible 0.100" pitch receptacle. The unshrouded header requires the receptacle to provide guidance and retention.