The FCI / Amphenol 95687-126HLF is a 26-position, dual-row BergStik® II unshrouded male pin header. It uses the standard 0.100" (2.54mm) pitch on both rows and between rows, which matches the footprint of classic DIP ICs and perfboard — a board layout engineer can drop this into a 0.100" grid without re-spinning the layout. The 5A per-contact rating and 110V voltage rating are typical for this class of signal/power interconnect; the 30.0µin (0.76µm) gold or GXT™ plating on the mating surface gives it a solid corrosion margin and supports repeated mating cycles in environments where the board might see field service.
The 0.100" pitch is the bread-and-butter spacing for 2.54mm-grid prototyping and production boards — the 0.100" row spacing matches the same grid, so this header occupies a 0.200" x 1.300" footprint (two rows, 13 positions per row). The 0.360" (9.14mm) mating pin length gives enough reach to engage with standard box headers or IDC sockets; the 0.360" solder tail length suits boards around 0.062" thick with standard through-hole plating. The 5A per-contact current rating is conservative for a phosphor bronze contact at this pitch — the real limit in a dense board is the temperature rise from all 26 circuits carrying current simultaneously. For signal duty (logic levels, a few mA) it's overkill; for power distribution, derate based on the number of active pins and ambient temperature. The 110V rating is typical for this class; it's not a high-voltage part, so keep it inside the enclosure.
The 26-position count and dual-row layout are the BOM match points; verify the mating half has the same position count and row configuration. The gold or GXT™ plating at 30µin is a good middle ground — it handles the occasional unplug/reconnect in field service without the cost of heavy gold, but it's not rated for thousands of cycles like a high-end backplane connector.