It uses a 0.100" (2.54 mm) pitch on both rows and contacts, with a 0.100" row spacing — a standard footprint for board-to-board stacking or wire-to-board interconnect when paired with the matching receptacle. The through-hole solder termination gives a mechanically robust joint for the 0.820" overall contact length — the 0.360" post length suits standard PCB thicknesses in the 0.062" to 0.093" range. Typical use is as a general-purpose board-to-board interconnect in industrial controls, test equipment, and computing peripherals where the 34-position density fits a parallel data bus or I/O ribbon.
Mating and dimensions
The 0.360" mating contact length provides enough wipe for reliable contact under normal board-stacking heights. Overall dimensions: 0.820" total contact length, 0.100" insulation height above the board. The pinout follows the standard dual-row grid: odd-numbered pins on one row, even on the other, with 0.100" between centres.