Board-to-Board Header for Standard 0.100" Pitch Layouts
The through-hole termination and 0.360" (9.14mm) solder tail length suit it for standard PCB thicknesses, while the 0.100" (2.54mm) insulation height keeps the mated stack low. It is rated for 5 A per contact at 110 V, with a tin-on-tin contact system — the mating finish is 100.0 µ" (2.54 µm) tin over phosphor bronze, a durable, cost-effective choice for moderate-cycle applications where gold's low-level-signal advantage isn't needed.
Fit and Footprint: What the Ratings Mean
The 0.100" (2.54mm) pitch and row spacing are the industry standard for BergStik and similar pin headers — the footprint is a 2 x 18 grid of 0.025" square pins on 0.100" centers. The 0.360" (9.14mm) mating pin length provides enough reach to engage with standard 0.100" pitch IDC sockets and shrouded headers. The 0.360" (9.14mm) post length gives a solid solder joint through a 0.062" board. The 110 V rating is conservative for the 0.100" pitch and unshrouded design — creepage and clearance are adequate for most low-voltage board-level interconnects.