It uses a 0.100" (2.54 mm) square pin grid on both pitch and row spacing, making it a standard footprint for prototyping and production board-to-board interconnects.
The 100.0 µin (2.54 µm) tin finish on the mating surface is a production-grade plating — it handles a reasonable number of mating cycles for a board-to-board interconnect, but it is not specified for frequent field disconnection. The 110 V rating is typical for signal-level headers in this pitch class; the limiting factor in a real assembly is more often the adjacent pin spacing and the PCB trace width than the connector itself.
Construction and board fit
Through-hole solder termination with a 0.360" (9.14 mm) post length — enough to clear a standard 0.062" board and still leave a visible solder fillet on the bottom side. The overall contact length is 0.820" (20.83 mm), which sets the mated stack height when paired with a matching BERGSTIK II socket.