68-Position BERGSTIK II Unshrouded Header
It's a board-to-board interconnect with a 0.100" (2.54 mm) pitch on both the mating and row spacing, creating a uniform grid footprint that simplifies PCB layout. The header carries 68 male pins, all loaded, with a tin-plated mating finish at 100.0 µin thickness — a robust coating for moderate-cycle applications.
The dual-row, 68-position count means 34 pins per row — a common density for a 0.100" pitch signal bus. The 0.100" (2.54 mm) pitch is a de facto industry standard; the footprint matches legacy backplane patterns and is widely supported by IDC ribbon cable receptacles. The through-hole solder termination with a 0.360" (9.14 mm) post length gives a solid mechanical anchor in the PCB, suitable for wave or hand soldering.
This header mates with any standard 0.100" pitch, dual-row, 68-position receptacle housing — typically a BERGSTIK II or equivalent IDC socket. For wire-to-board applications, the mating half would be a crimp or IDC receptacle with 0.100" pitch contacts. The tin-on-tin contact interface is rated for moderate mating cycles — suitable for field-service reconnections but not thousands of cycles like gold-plated systems.