Amphenol ICC BERGSTIK® unshrouded breakaway header, 44 positions, dual-row 0.100" pitch, surface-mount solder tails, gold GXT™ mating finish, UL94 V-0, active production.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.084\" (2.14mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Bulk |
| Features | Board Guide |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 44 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Surface-mount solder tails place the header flat on the PCB for reflow assembly.
Fastening is push-pull, meaning no latch or screw: the retention comes from the contact normal force alone, adequate for low-vibration board-to-board stacks.
It carries 44 positions total, all loaded.
It is a surface-mount (SMT) header. The solder tails are designed for reflow soldering onto the PCB pads, not for through-hole wave soldering.
Sourced to order against your BOM quantity. Availability and current pricing confirmed at quote time — submit an RFQ for this exact order code.