Amphenol Minitek 98423-F61-23ULF Header 46-Pos 2.00mm
Amphenol Minitek 2.00mm 46-position board-to-board header, dual-row, right-angle through-hole, gold flash mating / 2.00µm tin solder post, 2A per circuit at 200V, push-pull fastening, UL94 V-0 black thermoplastic, 0.157" insulation height.
Specifications
| Parameter | Value |
|---|---|
| Series | Minitek® 2.00mm |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 200V (AC/DC) |
| Current rating | 2A (AC/DC) |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.157\" (4.00mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 46 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.098\" (2.50mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.157\" (4.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | Flash |
Frequently asked questions
What does 98423-F61-23ULF mate with?
It mates with the matching dual-row Minitek 2.00mm receptacle housing in the 98423 series. The push-pull header seats into the receptacle's internal geometry — there is no independent latch on the header itself, so confirm the receptacle provides adequate retention.
Is 98423-F61-23ULF available via RFQ confirmation and what is the lead time?
Availability and current lead time are confirmed at quote time against your RFQ. The part is sourced to order through independent distribution — submit a quote to get a firm lead time and unit pricing for your BOM quantity.
What is the contact plating on 98423-F61-23ULF?
Gold flash on the mating face, 2.00µm tin on the solder post — the standard split for a cycling-capable signal header where solder-side durability and solderability matter more than the mating interface current density.