Surface-mount termination with a pick-and-place feature and keying slot for orientation control during automated assembly.
Gold GXT™ on the mating surface at 30.0µin thickness — this is a robust plating for repeated mating cycles and corrosive environments, rated well above the 2A per-contact current ceiling. Tin-plated solder posts (78.7µin) for the board-side connection, compatible with standard reflow profiles.