18-Pin DIP Socket for 0.3" Row-Spacing ICs
The DILB18P-223TLF: It is an open-frame, through-hole socket that accepts standard DIP packages — the open frame aids airflow and inspection of solder joints on the board.
Tin-Lead Contacts: Fit for Legacy and Low-Cycle Sockets
Tin-lead is a legacy plating — it provides good solderability on the post side and adequate wear resistance for occasional IC insertion and removal (typically under 50 cycles). For high-reliability or frequent rework applications, a gold-flash sibling in the DILB series would offer higher cycle life. The termination post length is 0.124" (3.15 mm), standard for through-hole soldering into a PCB — the post protrudes enough for a reliable solder fillet on a typical 0.062" board.
Active Production and RoHS Compliance
The part is RoHS compliant despite the tin-lead contact finish — lead in certain connector plating alloys is exempted under RoHS Directive Annex III. No additional compliance documentation is required for standard shipments.
Comparing to Higher-Pin-Count DILB Siblings
For a 24-pin DIP with the same 0.3" row spacing, the DILB24P-224TLF is a direct pin-count upgrade — same pitch, same tin-lead finish, same 1 A rating, same active status. The DILB24P-223TLF and DILB32P-223TLF use a wider 0.6" (15.24 mm) row spacing, so they fit larger DIP packages (e.g., 24- or 32-pin wide-body ICs). Choose the row spacing first — the 0.3" version mates only with narrow DIPs.