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Amphenol DILB20P-223TLF — IC & Device Sockets

DILB20P-223TLF DIP Socket 20-Pin 0.3" Row Spacing Tin

MPNDILB20P-223TLF
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Amphenol ICC (FCI) DILB20P-223TLF, DIP socket, 20 positions (2 x 10), 0.3" (7.62 mm) row spacing, 0.100" (2.54 mm) pitch, tin-plated contacts, 1 A, through-hole solder termination, open-frame nylon housing, UL94 V-0, tube package.

$0.7800Ref. price · indicative, final on quote
Amphenol DILB20P-223TLF datasheet (PDF)
RoHSRoHS Compliant
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

DILB20P-223TLF key specifications
ParameterValue
TypeDIP, 0.3\" (7.62mm) Row Spacing
MountingThrough Hole
Current rating1 A
Operating temperature-55°C~105°C
Housing materialPolyamide (PA), Nylon
Contact material - postCopper Alloy
Contact material - matingCopper Alloy
Material flammability ratingUL94 V-0
PackageTube
FeaturesOpen Frame
TerminationSolder
Pitch - post0.100\" (2.54mm)

All specifications

DILB20P-223TLF additional specifications
ParameterValue
Pitch0.100\" (2.54mm)
Contact resistance30mOhm
Contact finish - postTin
Contact finish - matingTin
Termination post length0.124\" (3.15mm)
Contact finish thickness - post100.0µin (2.54µm)
Contact finish thickness - mating100.0µin (2.54µm)
Number of positions or pins20 (2 x 10)

Product details

20-Pin DIP Socket for 0.3-Inch Row Spacing ICs

The DILB20P-223TLF: The open-frame nylon housing (UL94 V-0) allows airflow around the IC during operation, which helps with thermal management in enclosed assemblies.

Position Count and Peer Comparison

With 20 positions, this socket sits between the 16-position DILB16P-223TLF and the 28-position DILB28P-223TLF in the same DILB series, all sharing the same 0.100" pitch, tin plating, 1 A rating, and tube packaging. The 0.3" row spacing is consistent across the 14-, 16-, and 20-position variants, while the 28-position part uses 0.6" (15.24 mm) row spacing — a key difference when matching the IC footprint.

Frequently asked questions

Is DILB20P-223TLF compatible with 0.3-inch row spacing DIP ICs?

Yes.

What is the difference between DILB20P-223TLF and DILB16P-223TLF?

The DILB20P-223TLF has 20 positions (2 x 10) while the DILB16P-223TLF has 16 positions (2 x 8). Both share the same 0.3" row spacing, tin plating, 1 A rating, and tube packaging.