32-Pin DIP Socket – 0.6" Row Spacing, 0.100" Pitch
The DILB32P-223TLF: Open-frame construction aids airflow around the DIP device during operation, reducing local heating compared to a closed-frame socket.
Contact Plating and Termination – Tin-Lead, 100 µinch
The termination post length is 0.124" (3.15 mm), suited for standard through-hole soldering on typical PCB thicknesses. Contact resistance is rated at 30 mOhm, typical for tin-plated DIP sockets and adequate for low-current logic signals.
Position Count vs. Peer DILB24P-223TLF
Compared to the DILB24P-223TLF — which shares the same 0.100" pitch, 0.6" row spacing, 1 A rating, tin-lead plating, and UL94 V-0 housing — the DILB32P-223TLF offers 32 positions (2 x 16) versus 24 positions (2 x 12). For a BOM that needs fewer DIP pins on the same footprint, the 24-position sibling is a direct drop-in alternative with identical electrical and mechanical characteristics.