57-Position ZIF at 0.50mm Pitch — Board Layout Fit
Rated 0.5A per contact at 50V, this is a signal-level interconnect for digital or low-power analog paths. The gold-plated phosphor bronze contacts (1.97µin gold over nickel) handle 30 mating cycles minimum — adequate for internal harnesses that connect once during assembly and rarely disconnect in the field.
0.50mm Pitch and 57 Circuits — Routing Density
At 0.50mm pitch, the 57 positions occupy roughly 28.5mm of board edge — a dense interconnect for applications where PCB real estate is tight. The bottom-contact design means the FPC traces face the PCB pads, keeping the signal path short. The 0.100" (2.54mm) height above board leaves room for passives under the connector body.
The connector is RoHS compliant and the LCP housing is rated UL94 V-0.
The cable end can be straight or tapered — the ZIF mechanism accommodates both.