Single-contact compression spring pin for board-level interconnect
The Z02B-4F7L1-11000-E000: This is a single-contact, non-gendered compression spring pin — a pogo-pin style interconnect, not a traditional header. It mates by pressing against a flat pad on the opposing board or contact surface, making it useful for board-to-board stacking, test fixtures, or battery contacts where a low-profile, separable connection is needed. The Surface Mount termination suits automated pick-and-place assembly, though the spring force means the solder joint sees mechanical stress during mating; pad layout should follow the manufacturer's recommended footprint.
Gold thickness and peer alternatives
The 8.00µin gold here is a step up from the flash gold on the Z02J-4F7L1-11000 and Z02E-4F7L1-11000 siblings. Flash gold is typically under 5µin and wears faster — if your application cycles the contact more than a few hundred times, the 8.00µin version buys you a longer service life before base-metal exposure. The Z02D-4F7L1-11000-E000 shares the same 8.00µin gold and identical construction — functionally a direct cross for BOM matching. All four parts are active, so no lifecycle urgency on this line.