Board-Stacking Header, 50 Positions, 0.50mm Pitch — Hirose DF12 Series
The Hirose DF12NB(3.0)-50DP-0.5V(51) is a 50-position, 0.50mm pitch board-to-board header from the DF12 series, designed for parallel PCB stacking with a mated stack height of 3mm. Typical use is in compact electronic assemblies — handheld devices, camera modules, or any application where two PCBs need a dense, low-profile interconnect.
The 0.50mm pitch is tight — it forces fine-line PCB routing and a precise footprint. The 3mm mated stack height is the critical dimension: it sets the distance between the two parallel boards. That 3mm is the final stack after the header and its receptacle are mated; the board-to-board gap is fixed by this value, so your enclosure's z-height budget must accommodate it. The outer shroud contacts add a degree of pin protection that an unshrouded header lacks — the shroud absorbs minor misalignment during blind mating.
The termination is SMT only; the header is placed on the board and reflow-soldered.