The Hirose DF12NB(3.0)-80DS-0.5V(51) is an 80-position receptacle from the DF12 series, designed for board-to-board mezzanine stacking. It uses center strip contacts on a 0.020" (0.50mm) pitch across two rows, with a mated stacking height of 3mm.
80-Position Density and Stack Height Fit
At 80 positions, this is the highest-density member in the DF12NB(3.0) sub-series. The 0.50mm pitch packs the contacts tightly for high-signal-count mezzanine links, but the 3mm mated stack height limits the z-budget — the opposing board sits 3mm above the host board, so any components on the underside of the top board must clear that gap. The 0.087" (2.20mm) height above the host board leaves room for routing under the receptacle body. Compared to the 50-position DF12NB(3.0)-50DS-0.5V(51), the extra 30 circuits come at the same pitch and stack height, so the footprint length scales with position count — verify the board edge clearance for the longer body.
SMT Assembly and Solder Retention
No secondary locking or TPA — the solder joints provide the mechanical retention once reflowed.