Hirose DF12 series, 0.50mm pitch, 80 positions, dual-row, SMT header, outer shroud contacts, 3mm mated stack height, gold plating 8.00µin.
| Parameter | Value |
|---|---|
| Series | DF12 |
| Mounting | Surface Mount |
| Connector type | Header, Outer Shroud Contacts |
| Height above board | 0.091\" (2.30mm) |
| Mated stacking heights | 3mm |
| Pitch | 0.020\" (0.50mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Board Guide, Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 80 |
| Contact finish thickness | 8.00µin (0.203µm) |
The DF12(3.0)-80DP-0.5V(86) is a Hirose DF12 series board-to-board mezzanine header. It is an 80-position, dual-row, surface-mount header with outer shroud contacts, designed for a 3 mm mated stack height. The connector sits 2.30 mm above the board after mounting.
The 2.30 mm height above board tells you the z-height clearance needed on the board after reflow.
The mated stack height is 3 mm. The connector sits 2.30 mm above the board after mounting.
The pitch is 0.50 mm (0.020"). It is a dual-row header with 80 positions total.
This part is obsolete; we source it to order against your RFQ.