The Hirose FunctionMax™ FX30B-2P-3.81DSA25 is a 2-position, single-row board-to-board header on a 3.81 mm pitch. It carries a 16 A per-circuit rating — that current level at this pitch means it is sized for power distribution between stacked PCBs, not just signal-level interconnect. The 250 V voltage rating and the 25 mm mated stack height confirm its role as a mezzanine power interconnect for boards that need a fixed z-axis clearance.
The contact finish is gold on the mating side (3.90 µin) and tin on the post (39.4 µin) — the gold layer is thin but adequate for the moderate mating cycle count typical of a fixed board-stack application; the thicker tin post ensures a reliable solder joint. The insulation material is UL94 V-0 rated polyamide, and the operating temperature range spans -55°C to 105°C, making it suitable for industrial equipment housed inside an enclosure where flame rating and thermal cycling are requirements.