Board Layout Fit: 1.00 mm Pitch, Vertical SMD
The 10FMN-BMT-A-TF(LF)(SN): The vertical orientation (contacts, vertical - 1 sided) means the FFC inserts straight down, and the 5.10 mm height above board clears most low-profile enclosures. The Low Insertion Force (LIF) design reduces the force needed to seat the FFC, which helps avoid pad damage on thin flex circuits during assembly or field rework.
FFC Thickness and Housing Material
Peer Comparison: Vertical vs Right-Angle
The closest functional sibling is 10FMN-BMTTN-A-TF(LF)(SN) — same 10 positions, 1.00 mm pitch, vertical orientation, and 5.10 mm height. The difference is the tape-and-reel packaging variant (Digi-Reel® option on the sibling). For a right-angle board edge mount, the 10FMN-SMT-A-TF(LF)(SN) drops the height to 3.00 mm and changes the contact orientation to top-entry, which alters the FFC routing path.
