1.00 mm Pitch, 12 Circuits – FPC Fit for Signal Bundles
The 0.5 A per-contact current rating and 50 V voltage ceiling define it as a signal-level interconnect — suited for FPC ribbon bundles carrying sensor data, encoder signals, or low-power control lines inside compact enclosures. The Low Insertion Force (LIF) design means the FPC slides into the contact slot without a separate locking actuator — the contact beams grip the FPC pads directly. This keeps the mated profile low at 3.00 mm above the board, useful where z-height is tight.
Tin-Plated Contacts and LIF Retention
Contacts are tin-plated phosphor bronze. The LIF retention relies on the contact beam spring force, not a secondary latch — the FPC is held by the normal force of the contacts against the pads. The housing is black polyamide (PA6T) rated UL94 V-0, and the connector accepts 0.30 mm thick FFC.
The contacts are on the top side of the connector. Termination is solder — reflow the SMT pads to the board; no press-fit or crimp option. The base product number is 12FMN-SM — use this for cross-referencing mating FPC part numbers within the FMN series.