60-Position, 0.50mm Pitch Mezzanine Receptacle for Board-Stacking
The connector accepts mated stacking heights of 4.5mm, 5mm, or 6mm, giving the board layout engineer a choice of z-height without changing the footprint.
The mated stacking heights of 4.5mm, 5mm, and 6mm cover the common mezzanine spacing range for compact electronics. The 0.50mm pitch drives a tight footprint — expect fine-pitch routing on inner layers to escape the pads. The dual-row layout packs 60 signals into a narrow body, which keeps the board area small but demands precise stencil alignment for the SMT solder paste. Solder retention features on the body add mechanical hold during the reflow process and help the connector stay put under vibration after assembly.
The JMD series also offers a 70-position sibling (70R-JMDSS-G-1-TF(S)(LF)(SN)) at the same 0.50mm pitch, same 3.10mm height above board, and same gold contact finish. The choice between 60 and 70 positions is driven purely by the signal count on the BOM — the footprint and routing pitch are identical, so a board laid out for one can be adapted to the other with a pad-pattern change. No other functional specs differ between the two.