ROHS3 compliant, meeting current environmental requirements for electronic assemblies.
The 2-position B02B-ZESK-1D(T)(LF)(SN)(N) shares the same 1.50 mm pitch, tin plating, shrouding, and locking ramp as the 4-position B04B-ZESK-1D(T)(LF)(SN)(N) — the only difference is the number of circuits, which directly scales the board footprint width. For a 2-circuit wire-to-board connection, this header is the smallest available in the ZE series; the 4-position version is the next step up if the design needs additional signal paths.