Through-Hole Solder, Unshrouded — Board Layout Fit
The B2P-SHF-1AA(LF)(SN): Mated stacking height is 14.9 mm, which sets the clearance between the PCB and the mating wire housing. Insulation height is 0.126" (3.20 mm) above the board surface.

JST NH series, 2-position unshrouded header, 2.50 mm pitch, 3 A, 250 V, tin-on-tin contacts, friction lock, through-hole solder termination.
| Parameter | Value |
|---|---|
| Series | NH |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Friction Lock |
| Voltage rating | 250V |
| Current rating | 3A |
| Operating temperature | -25°C~85°C |
| Contact material | Brass |
| Insulation color | Natural |
| Insulation height | 0.126\" (3.20mm) |
| Insulation material | Polyamide (PA66), Nylon 6/6 |
| Mated stacking heights | 14.9mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.098\" (2.50mm) |
| Positions | 2 |
| Contact finish - post | Tin |
| Contact length - post | 0.134\" (3.40mm) |
| Overall contact length | 0.496\" (12.60mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.236\" (6.00mm) |
The B2P-SHF-1AA(LF)(SN): Mated stacking height is 14.9 mm, which sets the clearance between the PCB and the mating wire housing. Insulation height is 0.126" (3.20 mm) above the board surface.
This header mates with a JST NH series 2-position receptacle housing that accepts the matching crimp terminal.
Yes, it is RoHS compliant.