1.00 mm Pitch, 10 Circuits — Board-to-Cable Footprint
Tin plating is suited for low-cycle-count applications — expect a few dozen matings before contact resistance begins to drift.
SMT with Solder Retention and Pick-and-Place
The pick-and-place surface allows vacuum nozzle handling for automated assembly lines. This is a fixed dimension — no adjustment for different wire gauges or cable diameters. The housing is natural (uncolored) polyamide, UL94 V-0 rated for flammability.
The base product number is BM10B-SR, so variants like BM10B-SRSS-TB (without the lead-free suffix) share the same footprint and mating half.
